Wafer film laminator, wafer bonder, substrate film laminator, film transfer machine, wafer cleaning machine, custom non-standard automation equipment and equipment modification, committed to providing customers with professional solutions and high-performance semiconductor equipment.

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Film Application Series

Wafer laminating machine (before BG thinning)
Wafer laminating machine (before chemical plating)
Wafer laminating machine (before cutting)
Wafer pouring machine (facing and changing)
Wafer film tearing machine
Substrate laminating machine
Temporary Bonding/Debonding Series

Full-automatic temporary bonding machine
Full automatic UV debonding machine
Full-automatic laser debonding machine
Thermo-sliding debonding machine
Automated Customization Series

Loading/unloading module (load port)
Wafer edge finding module (Aligner)
Robot (Robot)
Customization and transformation of non-standard automation equipment

Company Profile

Qualifications and

Honors

Film Application Series

Temporary Bonding Series

Automation Series

Film Lamination Field

Temporary Bonding Field

Automation Field

Marketing Network

Technology Innovation

Contact Information

Online Message

Cooperation Hotline: 176-8816-5686

Working hours: 09:00-18:00

Wafer laminating machine (before BG thinning)Wafer laminating machine (before chemical plating)Wafer laminating machine (before cutting)Wafer pouring machine (facing and changing)Wafer film tearing machineSubstrate laminating machine

Full-automatic temporary bonding machineFull automatic UV debonding machineFull-automatic laser debonding machineThermo-sliding debonding machine

Loading/unloading module (load port)Wafer edge finding module (Aligner)Robot (Robot)Customization and transformation of non-standard automation equipment

Cooperation Hotline: 176-8816-5686

Wafer laminating machine (before BG thinning)
Wafer laminating machine (before chemical plating)
Wafer laminating machine (before cutting)
Wafer pouring machine (facing and changing)
Wafer film tearing machine
Substrate laminating machine

Full-automatic temporary bonding machine
Full automatic UV debonding machine
Full-automatic laser debonding machine
Thermo-sliding debonding machine

Loading/unloading module (load port)
Wafer edge finding module (Aligner)
Robot (Robot)
Customization and transformation of non-standard automation equipment